
Thursday, April 9, 2026 | Touch Taiwan
Panel-Level Fan-Out Packaging (FOPLP) Technology Forum
Localization Trends in Semiconductor Photoresist Materials: Everlight Chemical’s Perspective on the Competitive Advantages of Taiwan’s FOPLP Industry Chain
Driven by high-performance computing (HPC) in the AI era, the expansion of FOPLP capacity has significantly increased material demand. As a key domestic supplier of semiconductor photoresists, Everlight Chemical will discuss how “localized supply” shortens customer verification periods and establishes a competitive “moat.” Furthermore, leveraging our long-term expertise in green chemistry, we will explore how eco-friendly photoresist materials—such as PFAS-free solutions—help the FOPLP manufacturing process achieve energy savings, carbon reduction, and compliance with environmental regulations.
Speaker
Huichuan Sang | Technical Asst.Manager
Technical Engineering Dept.
